Nextreme enhances eTEC technology to increase performance
(Technology News, 25 May 2007 )
Nextreme has enhanced its miniature embedded thermoelectric component (eTEC) material. The technology advancements have made it possible for researchers at Nextreme to consistently achieve temperature differentials of 55-60ºC with eTECs at room temperature. This achievement compares favorably with the performance of conventional thermoelectric technology, which is physically larger and typically produces 65ºC under the same conditions. Nextreme devices employ proprietary materials that are 5-15 um thick, about 100 times thinner than the typical 1 mm thick pellets used in conventional thermoelectric devices.
Nextreme’s eTECs are designed utilizing thin films that are small, thin, fast, efficient and reliable, adding as little as 100 microns (0.1 mm) of height to a heat spreader or package; enabling unobtrusive integration close to the heat source.
The eTEC’s ultra fast, millisecond response time rapidly cools or heats to maintain a precise temperature depending on the needs of the application. A typical device pumps a maximum heat flux of 150 W/cm2 with some designs delivering as much as 400 W/cm2 versus 10-20 W/cm2 for typical bulk TECs. Prototypes for Nextreme’s eTEC are available for sampling and are expected fully qualified by the third quarter of 2007.
