VeriSilicon, Chips&Media JV for Advanced Multimedia Solutions
(Interviews, 01 Feb 2007 )
VeriSilicon Holdings Co., Ltd and Chips&Media have announced that the companies have entered into a strategic partnership to offer combined Audio & Video solutions based on each other's technology. The new products will incorporate DSP solutions from VeriSilicon, for advanced audio processing and ultra-low power scalable video solutions from Chips&Media, as well as a complete system software framework.
Under the terms of the partnership, VeriSilicon will add Chips&Media video offering to its IP and ASIC platform portfolio, while Chips&Media will add ZSP(R) to its silicon offerings.
"We are very happy to work with VeriSilicon to proliferate our technology to a wider range of customers," said Jesse Lim CEO of Chips&Media. "By integrating our industry leading video IP and VeriSilicon's popular ZSP architecture, we will be able to offer best-in-class multimedia capabilities to a number of new silicon products."
"Our partnership with Chips&Media reflects VeriSilicon's continuing effort to offer SoC customers targeted application platform solutions for a given market segment. Both companies not only bring leading technologies, in terms of performance and power, for consumer electronics but strong product roadmaps and system expertise to help IC manufactures get to market quickly with the highest competitive products," said Dr. Wayne Dai, chairman, president, and CEO of VeriSilicon
