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| (Top News, 27 Mar 2008 ) |
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Infineon Technologies is the first semiconductor supplier to offer Voice-over-IP functionality for low-cost mobile phones, and enabling operators to offer fixed-mobile convergence by integrating Wi-Fi on its mobile phone platform. The solution helps to significantly reduce the bill-of-materials (BOM) cost for Wi-Fi enabled cell phones by up to 50 percent compared to existing solutions. At the Spring VON.x Conference and Expo in California, USA, Infineon announced availability of its reference platform for a low-cost dual-mode GSM/Wi-Fi solution. Together with Atheros Communications, Inc., a leading developer of Wi-Fi solutions for mobile, networking and computing products, Infineon has developed a fully-functional, low-cost, dual-mode GSM/Wi-Fi mobile platform. The complete reference solution will bring Wi-Fi technology to low-cost mobile phones, enabling millions of users worldwide to make high-quality VoIP calls at virtually no cost when connected to wireless local area networks (WLANs).
The XMM1013 platform delivers VoIP capabilities as well as GSM services for mobile handsets. To date, Wi-Fi technology has been used as a connectivity option for accessing Internet data in high-end smartphones. This new platform adds full VoIP capabilities to cellular handsets at unprecedented price points.
About the XMM1013 platform The XMM 1013 integrates the world’s lowest-cost cellular solution, based on Infineon’s established single-chip X-GOLD101, which has been sold over 50 million units and Atheros’ single-chip AR6101 ROCm, which is the industry’s lowest-cost wireless VoIP solution. This highly-integrated platform for cellular and Wi-Fi results in Infineon and Atheros pioneering the lowest price points for dual-mode GSM/Wi-Fi phones. Besides supporting VoIP clients such as MSN, Google Talk, Yahoo and FON, enabling users to make flat rate calls within Internet communities, the solution also provides high quality call performance and a talk time of six hours in VoIP mode.
Infineon Technologies AG |
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