Endicott Interconnect signs agreement for volume manufacturing of CoreEZ organic substrates

Endicott Interconnect Technologies has entered into a Sales and Manufacturing Agreement with Unimicron Technology Corp., Taiwan, to produce CoreEZ organic substrates at one of their facilities. Under terms of the agreement, EI, as the original design manufacturer, maintains control of the design and technical support worldwide for the CoreEZ product line. Unimicron will be the high volume manufacturer of CoreEZ products per EI’s specifications and requirements. Sales of CoreEZ product will be jointly handled by the two companies.

CoreEZ organic substrates offer a very dense, thin core, build-up flip chip technology that combines exceptional electrical, reliability and wireability performance with a very cost effective material set. It is ideally suited to high speed graphics and microprocessor applications.

Endicott Interconnect Technologies