Logic announces the latest Zoom Medical Development Kit and System on Modules (SOM) featuring Texas Instruments’ OMAP Processors

As the potential for integrated medical products continues to grow, Logic Product Development (Logic) and Texas Instruments Incorporated (TI) have released a new development kit specifically designed to quickly bring new medical products to market. The new Zoom Medical Development Kit (MDK) and companion System-on-Modules (SOMs) use TI’s OMAP35x processor to provide developers with a cost-effective, compact way to design and produce medical, industrial and other embedded applications.

The SOM-based development kit allows medical product companies to easily develop sophisticated integrated medical devices with advanced graphical user interface, smart and real-time physiological processing and wired and wireless connectivity options for patient monitoring and data logging applications. All of this is accomplished with a lower cost, highly flexible software development environment, and the SOM design ensures rapid manufacturing without requiring additional trials or product releases.

TI’s OMAP35x processors provide laptop-like performance at handheld power levels, with an integrated ARM® Cortex-A8 core, TMS320C64x+ digital signal processor (DSP), 2D/3D graphics engine and video accelerators. By combining this high-performance processor with the memory and connectivity (wired and wireless) subsystems supported by a full operating system into an off-the-shelf OMAP35x SOM, developers can take a superior end-product to market quickly and easily. For more information on OMAP, see http://www.ti.com/omap35xpr.
OMAP35x processors are available in two package options: 0.65mm pitch BGA and 0.4mm pitch BGA. By using the 0.4mm pitch BGA package with Package-On-Package capability to mount the memory on top of the OMAP35x processor, equipment manufacturers can deliver the smallest form factor and lowest power for medical and other embedded applications. These packages often require complex design and manufacturing, but the SOM module minimizes these challenges.

Logic has placed the OMAP35x processor onto a SOM-LV Type III form factor module. The OMAP 3 SOM, measuring 31 x 76.2 x 7.4 mm (1.22 x 3 x 0.29 inches), is small enough to fit into almost any application, yet includes all necessary development interfaces for today’s embedded products, including Bluetooth® 2.0 + EDR, 802.11b/g wireless Ethernet, USB 2.0 OTG, 24bpp TFT LCD controller and 4-wire touch screen.

In addition to providing the latest technologies, a variety of different operating systems can be used with the Zoom MDK, including Linux and Windows® CE . Designers will be able to port such application/UI frameworks, such as Google Android and Maemo, on top of the Linux board support package (BSP). Available BSPs for the general purpose Zoom OMAP35x Development Kit include several open source Linux offerings as well as Windows® Embedded CE 6.0. The multiple BSPs allow developers to select an OS that best supports their needs and costs.

Logic Product Development
Texas Instruments