Unisem and FlipChip International sign licensing agreement for wafer bumping and wafer level packaging technologies
(Business News, 18 Jun 2008 )
Unisem Berhad (Unisem) and its subsidiary Unisem-Advanpack Technologies Sdn Bhd (UAT) have entered into an agreement with FlipChip International, LLC (FCI) for the licensing of FCI痴 wafer bumping and wafer level packaging technologies. As part of the agreement, UAT will license FCI痴 core technologies, including its premier Spheron technology. FCI will further solidify its investment in the partnership by becoming a shareholder of UAT.
FCI痴 wafer bumping technology offers complete bumping solutions for fine pitch devices, including 0.125mm pitch densities and high-reliability applications requiring JEDEC Level 1 capability with the smallest form factor available. FCI痴 Spheron technology is designed for high-frequency RF wafer level chip scale packaging and utilizes a new dielectric material, which offers improved electrical and mechanical performance in handheld advanced mobile devices and other demanding applications.
