Z-PACK TinMan product portfolio expanded to include 6-pair module
(Product News, 30 Jun 2008 )
Tyco Electronics has added new 6-pair module to its Z-PACK TinMan backplane product portfolio. The new 6-pair module offers 80 differential pairs per inch fitting within a 1.15” card slot pitch. This module is ideal for customers looking to implement an extremely high density, cost-effective backplane interconnect system.
As with the entire Z-PACK TinMan product family, the 6-pair module provides 12+ Gb/s performance, a fully protected right-angle receptacle for use on daughtercards, and field repairability at the module or single pin levels. Additionally, low crosstalk and high throughput performance are achieved by positioning ground contacts within each column along with unique contact lead frame placements. Samples are available upon request.
