BI Technologies Expands Hybrid Microcircuit Capabilities with Hermetically Packaged Die
(Product News, 21 Jul 2008 )
TT electronics BI Technologies has expanded its hybrid microcircuit capabilities by hermetically packaging industry standard die and up-screening the components to meet military specifications. The packaged die service includes assembling, sealing, and screening the packages to MIL-STD-883 specifications, including leak, centrifuge, temperature cycle, burn-in and electrical testing. BI Technologies will also support quality provisions such as traceability, visual inspection and in-line QCI requirements.
With comprehensive in-house design, layout, manufacture and test capabilities, including environmental testing, BI Technologies is able to provide customers with more than just 'contract manufacturer' capabilities, Nelson continued.
BI Technologies is on the DSCC Qualified Manufacturer List of hybrid electronics suppliers (QML). The company's products meet the stringent requirements of MIL-PRF-38534, Class H.
