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Solid-state cooling device harnesses corona discharge

( 01 Aug 2008 )
By Matthew Miller, Editor in Chief, EDN.com

Thorrn Micro Technologies has demonstrated a small, silent, no-moving-parts cooling device that generates more airflow than mechanical fans four times its size while consuming less power and space. The 15×15× 2-mm RSD5 creates a breeze of 2.4m/sec, outperforming the 1.7m/sec that a mechanical fan measuring 40×40×10 mm can produce, according to the company.

The product of six years of National Science Foundation-funded research, the technology nestles live wires within half-cylinder beds that the company carves into a nonconducting plate. Application of a voltage through the wires causes a corona discharge, creating a microscale plasma. Free ions in the plasma then migrate from the wires to the plate, displacing air molecules as they go and generating a sustained wind.
Thorrn’s innovation lies in the structure that channels the airflow effectively enough to cool a 25W chip with a device smaller than 1 cm3 without risk of sparks or arcing. In the company’s current design, the contoured plate resides atop a heat sink, but plans call for integrating the technology directly onto ICs.

Thorrn Micro Technologies, www.thorn.com


Caption
This device pushes air molecules around to create a cooling breeze for laptops and handheld gadgets.


 
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