EV Group and Brewer Science Establish Ultra-thin Wafer Bonding Lab in Taiwan

EV Group and Brewer Science, Inc. announced the installation of an EVG 500 series wafer-bonding system at Brewer Science's Taiwan applications lab. Located in Hsinchu Science Park, this joint effort offers customers timely localized support in the Asia-Pacific region for 3D IC and other advanced process development programs. In a shared commitment to speed commercialization of through-silicon via (TSV) technology and enable the development of smaller, higher performance, and more power-efficient electronic devices, this move is set to continue the momentum of their joint development efforts.

In December 2007, EVG and Brewer Science announced ultra-thin wafer handling capability for TSV creation to enable 3D chip stacking. This joint development program continues efforts to provide a complete family of ultra-thin wafer handling solutions to leading-edge CMOS image sensors, DRAM, and integrated devices manufacturers, who demand wider temperature range, thin wafer etching, passivation and metallization. To better leverage their bonding and materials expertise and relationships in Taiwan, the two companies now bring local bonding capability to technology development teams for rapid process testing and development in the Asia-Pacific region.

EVG's 500 series wafer bonding system was integrated in the applications lab in December 2008.

Brewer Science, http://www.brewerscience.com
EV Group, http://www.EVGroup.com.