Fine pitch bump adapters adapt BGA devices to 0.4mm-pitch boards

Aries Electronics expanded its line of Fine Pitch Bump Adapters with the release of new adapters that accommodate boards with pitches down to 0.4mm. Part of the Correct-A-Chip series, the latest Fine Pitch Bump Adapters feature landing pads that can be designed to accept any device on any pitch and easily settle into fine pitch footprints including Thin-Shrink Small Outline Packages (TSSOP) and Quad Flat Packages (QFP) with pitches down to 0.4mm, allowing customers to use higher pitch devices on smaller pitch boards. In addition, the adapter bottom has raised connection pads up to 0.25mm, enabling easy mounting of the adapter to the target board.

With Aries’s latest Fine Pitch Bump Adapters, manufacturers can easily add components to the design at a minimal cost because of the open space now available on the top of the adapter board. Fine Pitch Bump Adapter boards are 0.813mm thick FR4 or Rogers 370 HR, with 1/2 oz. copper traces on both sides. The non-solder mask defined (NSMD) pads are finished with electroless nickel immersion gold. The apparatus can operate up to 221°F (105°C) for FR4 and 266°F (130°C) for lead-free. The new adapters are available in tape and reel for high speed SMT assembly and can be manufactured for RoHS compliance. Standard line and trace spacing down to 0.076mm can be used.

Aries Electronics Inc.
www.arieselec.com
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Aries Electronics’ new Fine Pitch Bump Adapters accommodate boards with pitches down to 0.4mm.