Virtual Lithography Tool Targets EUV, Double Patterning Lithography Challenges

KLA-Tencor Corp. has launched its latest generation of PROLITH virtual lithography tool, the PROLITH X3.1, which enables researchers at leading-edge chipmakers, consortia and equipment makers to quickly and cost-effectively troubleshoot challenging issues in EUV and double patterning lithography (DPL) processes, including line edge roughness (LER) and patterning issues associated with wafer topography. PROLITH X3.1 enables lithographers to streamline their research, conserve valuable lithography cell resources and accelerate product development.

PROLITH X3.1 features the first commercially available photoelectron model that simulates the outcome of EUV lithography processes, and has intuitive wafer topography set-up and improved wafer topography models that allow for fast, easy evaluation of double and single patterning non-planar lithography stacks, and next-generation non-planar devices like FinFETs.

KLA-Tencor's PROLITH X3.1 virtual lithography tool

KLA-Tencor