Power MOSFETs feature reduced top-side thermal impedance

Texas Instruments Inc.’s latest family of power MOSFETs dissipates heat through the top of the package for high-current DC/DC applications. The DualCool NexFET power MOSFETs have reduced end-equipment size, while providing up to 50 percent more current through the MOSFET and improving thermal management over other standard-footprint packages.

The enhanced packaging technology reduces thermal impedance to top of package from 10°C/W-15°C/W to 1.2°C/W, increasing power dissipation capability by up to 80 percent. This new family of five NexFET devices allows computing and telecom system designers to use higher current processors with expanded memory while saving board space. The MOSFETs can be used in a wide range of end applications, including desktop PCs, servers, telecom or networking equipment, basestations, and high current industrial systems. The devices’ SON package feature a 5x6mm footprint, saving 30mm² or component real estate compared to using two standard packages.

Texas Instruments Inc.

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Utilizing enhanced packaging technology, Texas Instruments’ DualCool NexFET power MOSFETs feature up to 50 percent more current through the MOSFET and improved thermal management over other standard-footprint packages.