D2S and JEOL Team Up to Improve Advanced Photomask Production

Design and software company D2S has announced a partnership with fellow eBeam Initiative member JEOL Ltd to provide a new mask data preparation (MDP) infrastructure that is optimized for JEOL's new JBX-3200MV mask writing system. JEOL will use D2S' patent-pending, model-based MDP technology for both variable-shaped beam (VSB) lithography and the newly-announced circular aperture option for its JBX-3200MV tool. Together, JEOL's system hardware and D2S DFEB mask technology will enable the use of circular main features and curvilinear assist features on advanced photomasks—essentially extending the use of optical lithography for 22nm-and-below integrated circuit (IC) processing.

As the semiconductor industry migrates to the 22nm node, the depth of focus of the contacts and vias become a large issue. Curvilinear assist features on photomasks aid in producing higher depth of focus. In addition, circular main features as the contacts and vias, instead of squares, helps with critical dimension uniformity, another important manufacturability criterion. Traditionally, higher mask costs resulting from increased shot counts have prevented curvilinear assist features and circular main features. D2S DFEB mask technology enables the connection between manufacturing and design to provide a solution that leverages the rounding nature of e-beams to significantly reduce shot count and write times for curvilinear assist features. JEOL's JBX-3200MV writer is equipped with circular apertures to shoot circular e-beam shots of various sizes efficiently. Together, photomasks with circular main features and curvilinear assist features can be shot efficiently. This allows masks of reasonable cost and yield to produce the best yielding wafers for the 22nm logic node.

JEOL

D2S