SEMICON Singapore 2010 Opens May 19

SEMICON Singapore 2010, Southeast Asia's largest exposition dedicated to semiconductor manufacturing technology, will open on 19 May, 2010 at the Suntec Singapore International Convention & Exhibition Centre.

SEMICON Singapore 2010 offers exhibitors a comprehensive three-day platform for showcasing advanced manufacturing equipment, materials and services for the production, testing and packaging of semiconductors and related technologies.

“Southeast Asia leads the world in test, assembly and packaging for the global semiconductor industry,” said Terry Tsao, President of SEMI Southeast Asia. “Because of its focus on this area of the technology, SEMICON Singapore 2010 is uniquely positioned to bring companies from throughout the region together to discuss leading technologies and opportunities.”

In addition to the three days of exhibition, SEMICON Singapore 2010 offers three days of business and technical programmes.

“The Singapore market is growing,” said Dr. Dan Tracy, Senior Director, Industry Research and Statistics, SEMI. “Key investments being made in Singapore include the IM Flash fab, which will begin equipping this year, and growth at GLOBALFOUNDRIES (formerly Chartered Semiconductor), TECH Semiconductor, and UMC, who continue to invest in technology and capacity. SEMI expects Singapore total fab capacity to increase 6.8 percent in 2010, with 300 mm capacity growing at 17 percent.”

Market Trends Briefing on May 19
The SEMI Market Briefing on 19 May will address topics including “Driving the Growth of Singapore’s Semiconductor Industry into the Future” by Fong Pin Fen, Head of Electronics, Singapore Economic Development Board; “Semiconductor Growth and Fundamental Trends” by Kevin Meehan, Partner, Bain & Company SE Asia Inc.; “The Outlook for Semiconductor Market” by Philip Koh, Research VP, Gartner Advisory Singapore Pte Ltd; and “Semiconductor Equipment and Materials Outlook” by Dr. Dan Tracy, SEMI.

Of special interest is the focus on 3D interconnects. Charles Vath, Vice President, Process and Package Development, ASM Pacific Technology Ltd, and a SEMICON Singapore Session Chair, says, “3D will require a different approach to design at both the chip and packaging levels. 3D packaging brings with it a whole new spectrum of processes, materials, equipment, and the related process, quality, and reliability issues.”

SEMI