TSMC Kicks Off Soft IP Program

Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) has expanded its IP Alliance to incorporate a soft IP program that will improve soft IP readiness for advanced technology nodes and drive earlier time-to-market.

TSMC is expected to provide specific design documents and technology information through the program so that partners can optimize their soft IP to TSMC's technology. TSMC will also collaborate with these companies to expedite soft IP readiness by aligning their development with TSMC's process technology roadmap.

Soft IP has historically been process technology independent and therefore was not optimized for power, performance and area considerations. Given the ever-increasing need of first time silicon success and early time-to-market for highly integrated circuits such as system-on-chip (SoC), close technical collaboration between the foundry and the IP provider is imperative to optimize this critical trade-off.

The new program enriches TSMC's IP alliance portfolio, encourages soft IP innovation and reuse through TSMC's Open Innovation Platform initiative, and helps deliver power, performance and area optimization that are a particularly important consideration to the success of products at advanced technology nodes.

TSMC kicked off the soft IP program by working with EDA and IP companies Arteris, Atrenta Inc., Cadence Design Systems Inc., Chips&Media, Imagination Technologies, Intrinsic-ID, MIPS Technologies, Sonics Inc., Synopsys Inc. and Vivante Corp.

TSMC

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