Fusion Mixed Signal FPGAs Feature Extended Temperature Grade

Microsemi Corp.'s Fusion mixed signal FPGAs are now available with 100 percent temperature screening from -55°C to 100°C. This advancement enables the company to bring the unique mixed signal integration advantages of Fusion to the military, avionics, and defense industries, where highly reliable operation at extreme temperatures is needed. Designers can take advantage of the inherent reprogrammability, high reliability and nonvolatility of the Fusion devices, which offer the additional benefit of firm error immunity. In addition, by offering analog and digital integration in a single chip, Fusion mixed signal FPGAs significantly reduce board space.

Fully tested across the entire temperature range of -55°C to 100°C, extended temperature Fusion FPGAs are offered in two densities of 600K and 1.5M equivalent system gates with up to 223 user I/Os. Functions such as power sequencing and monitoring, as well as supervision and monitoring of voltage, temperature and current can now be performed effortlessly at extreme temperatures. Extended temperature Fusion mixed signal FPGAs are an ideal solution for high reliability applications such as weapons systems and “down wing” aircraft systems that must operate in extreme environments.

Microsemi

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