Semtech Taps IBM for 3D IC Technology

Semtech Corp. is working with IBM Corp. and its innovative 3D through-silicon via (TSV) technology to develop a high-performance ADC/DSP platform that has applications in fiber optic telecommunications, high performance RF sampling and filtering, test equipment and instrumentation, and sub-array processing for phased array radar systems.

“Our strategic partnership with IBM is enabling Semtech and our leading-edge customers to define and develop a unique and versatile integrated ADC/DSP platform, applicable to multiple highly demanding system applications,” said David Clark, Vice President of Microwave & Millimeter-wave Products at Semtech. “Further, this first-generation 3D multi-chip module will validate key building blocks that will enable the accelerated time-to-market of future products with unique DSP content for specialized applications."

Semtech is partnering with IBM to develop the end-to-end module solution utilizing IBM’s 3D interposer technology to interconnect ADC functions in IBM custom logic SOI-based Cu-45HP technology with interleaver ICs in IBM’s 8HP BiCMOS SiGe technology. These two different technologies are connected through a single wiring layer on an interposer, which supports a bandwidth of greater than 1.3Tbps in this design.

IBM’s 3D technology combines cost effective 90nm BEOL wiring levels for high speed signaling between die as well as providing ultra high capacitance density by integrating deep-trench (DT) capacitors at the top surface of the interposer. As frequency increases, the use of integrated decoupling capacitors is more attractive to counteract power supply noise effects that typically may be second order issues for slower applications. The interposer also connects to a package using copper TSV technology.

Semtech

IBM