TSMC Joins SEMATECH to Accelerate Semiconductor Technology Development

Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) has joined SEMATECH, the international consortium of semiconductor manufacturers, as a core member. The cooperation will focus on advanced technology development to address some of the industry’s most pressing challenges.

TSMC and SEMATECH will collaborate on semiconductor R&D for IC process technologies for 20nm generation and beyond, including extreme ultra-violet (EUV) lithography, 3D interconnects, metrology, novel materials and device structures, and to develop critical infrastructure vital for next-generation manufacturing, including the transition to 450mm wafer size.

SEMATECH's strong relationships with suppliers, chip makers, universities, and research institutes around the world are a critical element in providing cutting-edge research and development to its members. SEMATECH’s other core members include GlobalFoundries, HP, IBM, Intel, Samsung, UMC, and the College of Nanoscale Science and Engineering (CNSE).

“This relationship further reflects our commitment to push the boundaries of innovation and deliver leading-edge technology to our customers,” said Jack Sun, Vice President and CTO, Research and Development, for TSMC. “This complementary cooperation leverages SEMATECH’s collaborative approach to lead critical industry technology transitions, with TSMC’s position as an industry leader in advanced technology development and manufacturing.”

“We're excited that this agreement expands our long-standing relationship with TSMC and we look forward to their contributions and technical insights from their perspective as a global leader in advanced semiconductor technology and manufacturing,” said Dan Armbrust, President and CEO of SEMATECH. “TSMC will be an important partner in accelerating the progress of R&D innovations and manufacturing solutions in leading edge technologies.”

SEMATECH manages an international network of world-leading collaborative partners, including foundries, IDMs, fabless, packaging and assembly companies, and material and equipment suppliers, to provide industry-wide solutions to the challenges of chip manufacturing.

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