TI PowerStack in Volume Production at Clark Facility

The PowerStack packaging technology,Texas Instruments Inc.’s innovative approach to packaging to tackle power density, reliability and performance at a lower cost, is in volume production at its Clark facility in the Philippines.

In a statement, Bing Viera, Managing Director of TI Philippines, said, “Clark is our newest, state-of-the-art assembly/test facility in the Philippines. This year, we are further expanding capacity for advanced packaging techniques in Clark, nearly doubling the site’s initial capacity by the third quarter.”

PowerStack technology’s benefits are achieved through an innovative packaging approach where TI’s NexFET power MOSFETs are stacked on a grounded lead frame, using two copper clips to connect the input and output voltage pins. This combination results in a more integrated quad flat no-lead (QFN) solution.

Stacking the MOSFETs in the PowerStack approach reduces package size by as much as 50 percent over alternative solutions, which position MOSFETs side-by-side. In addition, PowerStack packaging technology provides excellent thermal performance, higher current capability and higher efficiency for power management devices.

TI has already shipped nearly 30 million units of its PowerStack packaging technology.

According to Matt Romig, analog packaging at TI, performance requirements for computing applications are increasing to enable more content such as broadband mobile video and 4G communications. This is on top of the drive to develop more compact equipment. "Through a true revolution from 2D to 3D integration, PowerStack enables TI’s customers to meet these demands," he said.

Texas Instruments