Philips offers thermal models of its power semiconductors
( 01 Sep 2005 )
Royal Philips Electronics is providing thermal models of its power semiconductors to help customers accurately predict the thermal performance of their devices in a fraction of the time it takes to build and test prototypes. This enables customers to solve complex design issues and optimize thermal management of their designs. This is particularly important for DC/DC converters in power supplies for connected consumer applications such as laptops and mobile phones in which thermal management is an important consideration in the design process. Philips’ thermal models run on Flotherm thermal modeling software and are available to existing users of the software for free. The models incorporate features such as the device die, the die attachment and internal lead frame. This level of detail is essential if device-operating temperatures are to be modeled accurately. Thermal models are currently available for the following package types: TO220; D2-PAK; D-PAK; LFPAK; TSOP6; SOT23; and HVQFN. They can be downloaded individually from Philips’ Web site.
