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Bus switch families enhance performance of datacom and networking equipment

( 01 Oct 2003 )

Texas Instruments has announced the expansion of its signal switch portfolio with the introduction of the CB3T, CB3Q and CBT-C bus switch families. These new FET switches are said to provide high-performance, low-power replacements for standard bus-interface devices when signal buffering (current drive) is not required.

The CB3T, CB3Q, and CBT-C bus switch families optimize next-generation datacom, networking, computing, portable communications and consumer electronic designs by supporting both digital and analog applications, including PCI interface, USB interface, memory interleaving, bus isolation and low-distortion signal gating.

Today's system designers face the challenge of supporting mixed-mode signal operation, and therefore need bus-interface devices that provide input to output level shifting (i.e., voltage translation). The CB3T family provides this needed voltage translation interface between components that require the different signaling standards (TTL, LVTTL, etc.) common in mixed system environments.

Another challenge is to increase the performance of multi-channel applications that require transmission of huge amounts of data. The CB3Q family provides a high-performance interface solution for communications and networking infrastructure equipment, as well as other data-intensive computing applications. In addition, the higher signal switching speeds associated with today's high-performance systems often create the problem of increased undershoot, a potential source of data corruption. The active undershoot protection circuitry in TI's CBT-C family, reduces the possibility of undershoot induced data corruption in these high-speed applications.

CB3Q, CB3T and CBT-C devices will be available in packaging options such as the shrink small-outline package (SSOP), thin shrink small-outline package (TSSOP), thin very small-outline package (TVSOP), very fine pitch ball grid array package (VFBGA) and quad flatpack no-lead package (QFN) for reduced board area.

Texas Instruments
Fax 886-2-2378-6808
www.ti.com

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