Tessera offers 'world's first' CSP solution for highly-integrated RF modules

Tesssera, a developer of IP and services for chip-scale and multi-chip packages (CSPs and MSPs), has unveiled what it claims as 'the world's first CSP technology for highly-integrated RF modules'-the Pyxis platform. This packaging technology integrates RF devices with their surrounding circuitry while delivering cost, height and area savings for more feature-rich, low-cost wireless electronic products.

The company further claims that when compared to competitive alter-natives, such as ceramic and laminate modules, the Pyxis platform provides reductions of 50% in cost, 60% in height, and 75% in area. The Pyxis platform builds upon Tessera's mBGA technology, and integrates various other technologies such as flip-flop, integrated passives in silicon and on polyimide. It also incorporates new EMI shielding techniques. Says Craig Mitchell, vice president for marketing, 'Through a combination of these technologies, the platform overcomes the size, reliability, performance, thermal and noise isolation challenges currently impeding higher levels of RF integration.' To provide a clear path to mainstream adoption, the Pyxis platform leverages existing CSP and flip-chip manufacturing processes and established infrastructure. To facilitate easy adoption of the platform, Tessera is offering a full suite of RF services, design tools and libraries.

The Pyxis platform is designed to support and integrate a multitude of RF functions, such as power amplifiers, transceivers, filters and switches. The first implementation of the technology family, the Pyxis Power Amplifier platform, integrates tri-band GSM/ GPRS power amplifiers with their surrounding passive components.

Says Catherine de Villeneuve, director, RF market, 'By freeing PCB space, Pyxis can handle handset makers to quickly and easily incorporate new revenue generating features, such as MP3, GPS, Wi-Fi and digital imaging capability, into their products.'

The package is flexible, and can provide an integration and miniaturi-zation path for radio-in-a-package, 802.11, Bluetooth and other complex RF modules.

Tessera
Fax 1-408-894-0768
www.tessera.com