Triple-band power amplifier modules are versatile

Excellence in Communication Corp (EIC), a Taiwan specialist in RFIC design and manufacture, is offering two triple-band power amplifier modules (PAMs), the ECM007 and ECM009, for a potentially wide range of mobile communications market segments, including GSM Classes 8 and 10, and GPRS Class 12 (50% duty cycle). Both amplifiers are manufactured using EIC's own InGaP (indium gallium phosphide) GaAs (gallium arsenide) HBT (hetero-junction bipolar transistor) process technology.

With these modules, EIC is claiming a “world’s first” for an InGaP HBT GPRS Class 12 Tri-band PAM.

The ECM007 is available in an industry-standard 9×11-mm LCC package. The ECM009, the smallest GSM/GRS power amplifier currently available on the world market, is in a 6×6-mm LCC package.

Both of these modules are designed for use as RF transmitter amplifiers in triple-band GSM, DCS, and PCS handheld digital cellular equipment such as phones, PDAs (personal digital assistants), wireless modems and other applications in the 880 to 915 MHz, 1710 to 1785 MHz, and 1850 to 1910 MHz bands respectively. The modules contain a proprietary chip and passive components to achieve 50W impedance matching to the customer's design. These modules are compatible with ADI, LT, and Philips Power Control ICs.

While GSM Classes 8 and 10 are considered mainstream, few products are capable of supporting GPRS class 12. To date, the issue has been one of reliability, a definitive requirement for cellular communications applications. Using standard MOS technology, reliability could only be gained at the expense of a relatively large die. EIC’s InGaP GaAs HBT process achieves high-reliability Class 12 for 2.5G mobile communications, while conserving die size and maximizing both cost-performance and board space available to the designer. These design objectives are achieved in a low thermal resistance design, essential for support of GPRS Class 12, with a low external component part count.

Generally speaking, these PAMs are one-third the size of comparable products on the market, increasing design flexibility for smaller handsets and PDAs, and providing more space for increased functionality.

Dr. Nicky Lu, CEO of EIC, emphasized that with these new breakthrough PAM products, his company is pointing the industry towards the future. “In terms of technology, we are now entering another era. InGaP technology, when combined with the HBT structure, is not only sufficient to support 3G applications, the technology is extensible beyond 3G levels of reliability.”


IEC c/o Axtra Corp
Fax (886) 2-8226-2159
www.eiccorp.com