TI to highlight Sasken partnership at TIDC India 2006

Texas Instruments Incorporated (TI) announced that it will showcase its partnership with Sasken at the Texas Instruments Developer conference (TIDC) India to be held on November 30th and December 1st 2006 at the NIMHANS Convention Centre, Bangalore. Sasken, one of TI’s application software providers, offers a scalable, integrated application suite to boost development of affordable multimedia feature phones.

Application suites from an ecosystem of leading software providers are integrated onto TI’s LoCosto single-chip value platform and OMAP-Vox multimedia product family for a customizable solution on mobile phones. TI’s customers can select an application suite such as Sasken’s ARIA, Motorola’s Ajar, OpenPlug’s ELIPS and SKY MobileMedia’s SKY-MAP, that can be easily adapted to the needs of their handset products and specific operator and consumer requirements.

Remi El-Ouazzane, general manager of TI’s 2.5G business for wireless terminals business unit, said, “Together with its ecosystem of application suite providers, TI is committed to helping its customers differentiate in the highly-competitive wireless market by providing a variety of solutions. TI’s applications suite ecosystem provides multiple pre-integrated offerings based on selected superior solutions, resulting in flexible choices and faster time to market with customized, differentiated products.�

In choosing its ecosystem application suite providers, TI thoroughly evaluates suppliers on multiple selection criteria including software architecture, scalability, breadth of application components, MMI customizability, robust worldwide engineering support and meeting operator grade compliancy. The result is that handset manufacturers can choose from a selection of proven, scalable solutions on TI’s LoCosto and OMAP-Vox platforms for differentiated feature phone development.

TI