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| By Richard A Quinnell, Contributing Technical Editor, EDN |
| After languishing for years, home automation is seeing a surge of activity as new technologies, emerging standards, and the networking of consumer devices converge to develop the intelligent residence. |
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| By Margery Conner, Technical Editor, EDN |
| Receiving electrical power without the use of wires has long been an ideal for electronic devices. How feasible is it, and what are some of the other options? |
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| By Michael Fowler, Fairchild Semiconductor |
| Applying a systems approach to silicon design leads to success. |
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| By Chew, Chim Lai, Yeoh Theng Hooi, Chua Seng Yee, Avago Technologies ( Malaysia |
| In process flow control, there are many factors affecting variability but the greatest contributor is the control valve’s performance. Extensive studies have indicated as high as 80% of all control loops did not perform adequately. To implement tighter control loops, the key is to focus on improving |
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| by Chitra Giridhar, Bangalore Correspondent |
| With a heady 135 percent growth in revenues last year, Actel Corporation’s India operation continues to gain momentum. EDN Asia recently spoke with John East, President and CEO, and Dennis Kish, Senior Vice President, Actel Corporation, on the company’s technological and business ambitions in the co |
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| Patrick Weber and Craig Windish, Siemens Energy and Automation, Pittsburgh, PA |
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| John Guy, Maxim Integrated Products, Sunnyvale, CA |
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| David Williams, Millington, MI |
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| By Fanie Duvenhage, Security, Microcontroller and Technology Development Division, Microchip Technol |
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| By Richard F. Zarr, National Semiconductor Corporation |
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| By Barry Papermaster, Texas Instruments Incorporated |
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| By Kyaw Zin Min and Eric KoK, Infineon Technologies Asia Pacific Pte Ltd |
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| By Robin Lange, Managing Editor |
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| By Brian Dipert, Senior Technical Editor, EDN |
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| by Kirtimaya Varma, Editor-in-Chief |
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| by Isadore Katz, Meta-Software Inc. |
| When this Design Feature was written 12 years ago, the designer was facing the challenges of designing at the “deep-submicron” node of 500nm and below. Today he is facing the challenges of designing at the “deep-submicron”node of 45nm and below. Take a nostalgic drive into these challenges as you gr |
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| Hark the murmurs of the past and you will see the future of Asia coming. Through a peek into Regional Update, take a nostalgic retreat into the days when Asia was emerging as a global design and manufacturing center. |
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| by George Ellis, Contributing Editor |
| In March 1999, EDN Asia discussed this subject in its Cover Story. The story raked up some issues for designers to successfully implement the IP technology. These issues are very much alive today, eight years after the article was published. We have chosen to reproduce it for its current topicality |
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| by John P. Daane, Chairman, President, and CEO, Altera |
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