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(EDN Asia, 24 Jan 2012) |
| The VITA46 VPX standard defines a chassis that can accommodate all manner of cards with a common form factor. The cards plug into a common backplane. This design employs the VITA46.4 standard for PCIe .... |
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(EDN Asia, 20 Jan 2012) |
| Due to lower-than-expected consumer adoption of LED-backlit LCD TVs, manufacturers are changing their strategy on direct LED-backlit TV and are developing products that use less power and lowering costs .... |
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(EDN Asia, 19 Jan 2012) |
| MIPS Technologies, Inc. has joined the Renesas Electronics Corp.’ SoC Partner Program. The latter is a long-time licensee of the MIPS64 architecture and processor cores including the MIPS32 74K, 24KE .... |
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(EDN Asia, 18 Jan 2012) |
| Introduction of spikes in systems during insertion of power supply jacks is observed in a majority of designs. These spikes are mainly caused by either a very high frequency de-bounce on the power supply .... |
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(EDN Asia, 17 Jan 2012) |
| Taimide Technology, a Taiwan-based polyimide (PI) film supplier has invested $1.6 million in a research joint venture project with Arakawa Chemical Industries, a Japanese company which specializes in .... |
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(EDN Asia, 16 Jan 2012) |
| Energy Micro has appointed ZLG as its distributor for ultra low power ARM Cortex-based Gecko MCU and EFR4 Draco radio devices in China. Specializing in programmable semiconductor solutions, ZLG will support .... |
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(EDN Asia, 13 Jan 2012) |
| The Wireless Power Consortium (WPC) has selected Testronic Labs, a facility for quality assurance and localization services for film and television, games, websites, hardware, and software, as a Qi interoperability .... |
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(EDN Asia, 12 Jan 2012) |
| The JEDEC Solid State Technology Association, one of the leaders in the development of standards for the microelectronics industry, has announced the availability of a new standard for wide I/O mobile .... |
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(EDN Asia, 11 Jan 2012) |
| STATS ChipPAC has recently started constructing a new factory in Singapore, which will focus on wafer-level technologies including embedded wafer-level ball grid array (eWLB), wafer-level chip scale packaging .... |
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(EDN Asia, 10 Jan 2012) |
| Government initiatives and policies, venture funding, and R&D focused on electronics are envisioned to create more jobs in coming years. The IC design segment in India, which currently employs around .... |
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