Proxim Wireless Corporation has announced the availability of what’s said to be the industry's first 802.11n solution to achieve 320 Mbps of throughput with a dual-radio solution. In addition, Proxim's ....
Today's preferred rechargeable battery chemistry for small, lightweight, portable applications is lithium-ion. When it comes to power management for mobile phones, portable media players or navigation ....
International Rectifier has introduced the IRS2530D and IRS2158D 600V control ICs for energy-efficient dimming fluorescent lighting ballast applications. The IRS2530D DIM8 is a unique linear dimming ballast ....
Two new high-speed signal path products, a 16-bit, 130 mega-samples per second (MSPS) analog-to-digital converter (ADC) and a digital-controlled variable gain amplifier (DVGA), were announced by National ....
Fujitsu Asia recently launched the MJA2 CH series of Serial Advanced Technology Attachment (SATA) hard disk drives (HDDs) for the ASEAN and India markets. The series is said to be the first 500-gigabyte ....
This reference design for a 200W 1/16th brick offers higher than usual power density with very low component count. It delivers power density of more than 600W per square inch, which is more than 60 % ....
IneoQuest Technologies has introduced the VeriFrame, a new video content verification technology. Incorporated into IneoQuest's new iCMS (video content management software) and Cricket FrameGrabber hardware ....
Current-feedback amplifiers have a higher slew rate than do voltage-feedback amplifiers. As such, current-feedback amps can better solve high-speed problems than their voltage-feedback counterparts. The ....
Mimix Asia introduces an 8.5 to 11 GHz gallium arsenide (GaAs) monolithic microwave integrated circuit (MMIC) core chip, which consists of integrated transmit/receive switches, an LNA, a 6-bit phase shifter, ....
As the semiconductor industry strives to find new technologies to enable continued scaling, lower wafer processing costs and increased functionality of next generation ICs, 3D CMOS integration is poised ....
