EDN India - Processors & Tools

Texas Instruments unveils fully integrated analog front end for ECG and EEG applications

Tue, 7 Sep 2010 00:00:00 +0800

Texas Instruments Incorporated (TI) today introduced the first in a family of fully integrated analog front ends (AFEs) for portable and high-end electrocardiogram (ECG) and electroencephalogram (EEG) equipment, as well as patient monitoring and consumer medical applications. The eight-channel, 24-bit ADS1298 reduces component count and power consumption by up to 95 percent as compared to discrete implementations, with a power efficiency of 1 mW/channel, while allowing customers to achieve the h

Sunin to Distribute Energy Micro Products in Korea

Tue, 7 Sep 2010 00:00:00 +0800

Energy Micro has appointed Sunin Technology as a distributor in Korea. Under the terms of the agreement, Sunin is supporting the complete family of Energy Micro's low power MCUs, comprising the ARM Cortex ....

Multicore Processor Integrates 128 NXCPUs

Mon, 6 Sep 2010 00:00:00 +0800

NetLogic Microsystems Inc. has announced the innovative XLP8128S multi-core communications processor solution, which integrates 128 NXCPUs and over 160 programmable processing engines to deliver an unprecedented ....

Microchip to Hold Webcast on nanoWatt XLP Technology

Thu, 2 Sep 2010 00:00:00 +0800

Microchip Technology Inc., in cooperation with EDN Asia, the leading business-to-business media that gives extensive insight into the ever evolving electronics industry in Asia, will be holding a

Sponsored by Analog Devices, Inc. : The new and improved practical guide to high-speed PCB layout

Thu, 2 Sep 2010 00:00:00 +0800
The New and Improved Practical Guide to High-Speed PCB Layout will cover the ins and outs of high speed PCB design, with a practical and straight forward approach. The presentation is packed with useful information accumulated over the last three decades by presenters John Ardizzoni. The tips, tricks and techniques presented can be easily implemented into designs and will help improve overall circuit and system performance. This webinar will be a good refresher, and a �must see�, for those...

IBM Launches World's Fastest Microprocessor

Thu, 2 Sep 2010 00:00:00 +0800
IBM has announced details of the world's fastest computer chip—the microprocessor in a new version of the IBM mainframe that begins shipping to customers on September 10. The new zEnterprise technology ....

EDN Asia Resource Center: Your source for free design guides, evaluation kits, software samples and more!

Wed, 1 Sep 2010 00:00:00 +0800
NXP is a leading semiconductor company founded by Philips more than 50 years ago. Headquartered in Europe, the company has about 30,000 employees working in more than 30 countries and posted sales of USD 5.4 billion (including the Mobile & Personal business) in 2008.

- A Fully Integrated Ku-band PLL in SiGe:C for VSAT Applications

- Global Position System Low Noise Amplifier

NXP Enables 98% Efficiency in Solar PV Apps

Wed, 1 Sep 2010 00:00:00 +0800
NXP Semiconductors' MPT612 is a unique low-power IC dedicated to performing the Maximum Power Point Tracking (MPPT) function for applications using solar photovoltaic (PV) cells or fuel cells. Supported ....

Intel Warns Q3 Will Miss Expectations on Weak PC Demand

Mon, 30 Aug 2010 00:00:00 +0800
Intel Corp. this morning said its Q3 revenue will be below its previously announced outlook. The chip leader's revised outlook calls for September quarter revenue to be $11 billion, plus or minus $200 ....

Energy Micro Expands Asia Market

Fri, 27 Aug 2010 00:00:00 +0800
Energy Micro, the energy friendly microcontroller (MCU) company, has appointed Apps-Connect as a distributor for its growing family of ARM Cortex-M3 based low power EFM32 Gecko microcontrollers in the ....

Global PC MPU Unit Shipments, Revenues Up in 2Q10

Wed, 25 Aug 2010 00:00:00 +0800
Worldwide PC microprocessor unit shipments and revenues in the second calendar quarter of 2010 (2Q10) increased 3.6 percent and 6.2 percent, respectively, compared to the first quarter of 2010, according ....

Wafer-level Packaging Pushes Past New Mobile Demands

Wed, 25 Aug 2010 00:00:00 +0800
We hear a lot these days about 3D integration and the many benefits that vertical scaling can bring with it. But there is a significant amount of semiconductor packaging innovation still taking place ....

Intel and Nokia Establish Joint Research Center

Wed, 25 Aug 2010 00:00:00 +0800
Intel Corp., Nokia and the University of Oulu recently opened the Intel and Nokia Joint Innovation Center. It will employ about two dozen R&D professionals and become the latest member of Intel's European ....

EDN India - Processors & Tools

Texas Instruments unveils fully integrated analog front end for ECG and EEG applications

Sunin to Distribute Energy Micro Products in Korea

Multicore Processor Integrates 128 NXCPUs

Sponsored by Keithley Instrument Inc.: Advanced Measurement Techniques for OFDM and MIMO Based Systems

Microchip to Hold Webcast on nanoWatt XLP Technology

Sponsored by Analog Devices, Inc. : The new and improved practical guide to high-speed PCB layout

IBM Launches World's Fastest Microprocessor

EDN Asia Resource Center: Your source for free design guides, evaluation kits, software samples and more!

NXP Enables 98% Efficiency in Solar PV Apps

Intel Warns Q3 Will Miss Expectations on Weak PC Demand

Energy Micro Expands Asia Market

Global PC MPU Unit Shipments, Revenues Up in 2Q10

Wafer-level Packaging Pushes Past New Mobile Demands

Intel and Nokia Establish Joint Research Center