<?xml version="1.0" encoding="iso-8859-1"?><rss version="2.0"><channel><title>EDN India - Digital ICs</title><link>http://www.ednindia.com</link><description>EDN Asia - Digital ICs</description><language>en-US</language><copyright>Copyright 2010 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.</copyright><pubDate>Fri, 12 Mar 2010 03:56:27 +0800</pubDate><item><title>Atmel Intros Off-the-shelf Automotive-qualified Capacitive Touch Controller</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=25797&amp;title=atmelintrosofftheshelfautomotivequalifiedcapacitivetouchcontroller-Asia.html</link><description>Atmel Corp. unveils the first standard product capacitive touch controller in the industry that is fully qualified for the automotive market. Based on the patented QTouch capacitive touch technology for ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=25797&amp;title=atmelintrosofftheshelfautomotivequalifiedcapacitivetouchcontroller-Asia.html</guid><pubDate>Mon, 8 Mar 2010 00:00:00 +0800</pubDate></item><item><title>Renesas R8C e-Learning Program</title><link>http://www.ednindia.com/rss_bridge.asp?AdID=716&amp;URL=http://www.ednasia.com/WebcastRegister.asp?webcastId=27</link><description>The objective of this course is to provide a quick and simple way to learn about the R8C Family of MCUs and the unique benefits it brings to today’s engineers. The R8C series is a result of careful planning and implementation of various design techniques, keeping in mind the present and future requirements of embedded systems. &lt;br/&gt;&lt;br/&gt;To equip engineers with the fundamental techniques on how to optimize applications using R8C MCUs, this course is divided into three modules...</description><guid>http://www.ednindia.com/rss_bridge.asp?AdID=716&amp;URL=http://www.ednasia.com/WebcastRegister.asp?webcastId=27</guid><pubDate>Fri, 5 Mar 2010 00:00:00 +0800</pubDate></item><item><title>11th Annual ISQED to Address Electronic Design Challenges, Trends, and Proven Methodologies</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=25789&amp;title=11thannualisqedtoaddresselectronicdesignchallengestrendsandprovenmethodologies-Asia.html</link><description>The 11th annual International Symposium on Quality Electronic Design (ISQED), to be held on March 22-24, 2010 at the DoubleTree Hotel in San Jose, California, U.S.A., has just announced its lineup of ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=25789&amp;title=11thannualisqedtoaddresselectronicdesignchallengestrendsandprovenmethodologies-Asia.html</guid><pubDate>Fri, 5 Mar 2010 00:00:00 +0800</pubDate></item><item><title>Sponsored by Keithley Instrument Inc.: Advanced Measurement Techniques for OFDM and MIMO Based Systems</title><link>http://www.ednindia.com/rss_bridge.asp?AdID=631&amp;URL=http://www.ednasia.com/WebcastRegister.asp?webcastId=24</link><description>This is the advanced seminar of a multi-part series on OFDM technologies and testing. &lt;br/&gt;&lt;br/&gt;By attending this seminar you will learn:&lt;br/&gt;&lt;br/&gt;1, Signal Generation and Analysis, Instrument Considerations.  &lt;br/&gt;2. Spectrum measurement techniques and their application to high speed power measurements.  &lt;br/&gt;3. OFDM Amplifier measurement considerations - Quantative Gain Compression.  &lt;br/&gt;4. SISO OFDM measurement techniques.  &lt;br/&gt;5. MIMO measurement considerations.  &lt;br/&gt;6. MIMO measurement techniques.  &lt;br/&gt;</description><guid>http://www.ednindia.com/rss_bridge.asp?AdID=631&amp;URL=http://www.ednasia.com/WebcastRegister.asp?webcastId=24</guid><pubDate>Tue, 2 Mar 2010 00:00:00 +0800</pubDate></item><item><title>Plessey Semiconductors Outlines Product Strategy</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=25759&amp;title=plesseysemiconductorsoutlinesproductstrategy-Asia.html</link><description>Plessey Semiconductors has announced the planned release of a number of innovative semiconductor products, including a range of amplifiers, demodulators, synthesizers and high-speed pre-scalers, designed ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=25759&amp;title=plesseysemiconductorsoutlinesproductstrategy-Asia.html</guid><pubDate>Tue, 2 Mar 2010 00:00:00 +0800</pubDate></item><item><title>Sponsored by Analog Devices, Inc. : The new and improved practical guide to high-speed PCB layout</title><link>http://www.ednindia.com/rss_bridge.asp?AdID=580&amp;URL=http://www.ednasia.com/WebcastRegister.asp?webcastId=20</link><description>The New and Improved Practical Guide to High-Speed PCB Layout will cover the ins and outs of high speed PCB design, with a practical and straight forward approach. The presentation is packed with useful information accumulated over the last three decades by presenters John Ardizzoni. The tips, tricks and techniques presented can be easily implemented into designs and will help improve overall circuit and system performance. This webinar will be a good refresher, and a “must see”, for those...</description><guid>http://www.ednindia.com/rss_bridge.asp?AdID=580&amp;URL=http://www.ednasia.com/WebcastRegister.asp?webcastId=20</guid><pubDate>Tue, 9 Feb 2010 00:00:00 +0800</pubDate></item><item><title>Fujitsu Earns USB-IF Compliance Certification for SuperSpeed USB</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=25621&amp;title=fujitsuearnsusbifcompliancecertificationforsuperspeedusb-Asia.html</link><description>Fujitsu Microelectronics Asia Pte Ltd (FMAL) has announced that its USB 3.0-SATA bridge IC has been certified as compliant with the USB 3.0 standard by the USB Implementers Forum Inc.

The Fujitsu MB86C30 ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=25621&amp;title=fujitsuearnsusbifcompliancecertificationforsuperspeedusb-Asia.html</guid><pubDate>Tue, 9 Feb 2010 00:00:00 +0800</pubDate></item><item><title>STMicroelectronics Launches Highly Integrated Ultrasound Pulse Controller</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=25478&amp;title=stmicroelectronicslauncheshighlyintegratedultrasoundpulsecontroller-Asia.html</link><description>STMicroelectronics (ST) has introduced a highly integrated low-noise ultrasound pulse controller built using ST's advanced high-voltage BCD mixed-signal technology. The STHV748 provides four independent ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=25478&amp;title=stmicroelectronicslauncheshighlyintegratedultrasoundpulsecontroller-Asia.html</guid><pubDate>Mon, 25 Jan 2010 00:00:00 +0800</pubDate></item><item><title>Carnegie Mellon, Intel Partner to Improve Energy Costs, Efficiency in Chip Making</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=25471&amp;title=carnegiemellonintelpartnertoimproveenergycostsefficiencyinchipmaking-Asia.html</link><description>Carnegie Mellon University and Intel Corp. have unveiled a new class of materials called solder magnetic nanocomposites that could help streamline the process of computer electronic packaging. 

A Carnegie ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=25471&amp;title=carnegiemellonintelpartnertoimproveenergycostsefficiencyinchipmaking-Asia.html</guid><pubDate>Fri, 22 Jan 2010 00:00:00 +0800</pubDate></item><item><title>NXP, Intrinsic-ID to Collaborate on Chip Security</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=25467&amp;title=nxpintrinsicidtocollaborateonchipsecurity-Asia.html</link><description>NXP Semiconductors and Intrinsic-ID, an emerging semiconductor intellectual property (IP) and services provider, have entered into a collaborative agreement to license and deploy a hardware intrinsic ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=25467&amp;title=nxpintrinsicidtocollaborateonchipsecurity-Asia.html</guid><pubDate>Fri, 22 Jan 2010 00:00:00 +0800</pubDate></item><item><title>SPI/I2C UART Integrates an Oscillator</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=25438&amp;title=spii2cuartintegratesanoscillator-Asia.html</link><description>Maxim Integrated Products' MAX3107 is said to be the industry's lowest power, fastest, and smallest serial UART to communicate over an SPI(TM)/I2C interface. The device's low power consumption extends ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=25438&amp;title=spii2cuartintegratesanoscillator-Asia.html</guid><pubDate>Mon, 18 Jan 2010 00:00:00 +0800</pubDate></item><item><title>iSuppli Teardown: Google Nexus One Carries $174.15 Materials Cost</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=25401&amp;title=isuppliteardowngooglenexusonecarries17415materialscost-Asia.html</link><description>With its new Nexus One, Google Inc. has taken many of the latest smart-phone innovations and combined them in a single product that manages to be both cutting edge and cost competitive, according to a ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=25401&amp;title=isuppliteardowngooglenexusonecarries17415materialscost-Asia.html</guid><pubDate>Mon, 11 Jan 2010 00:00:00 +0800</pubDate></item><item><title>STMicroelectronics Launches 3D-ready Set-top-box IC</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=25371&amp;title=stmicroelectronicslaunches3dreadysettopboxic-Asia.html</link><description>STMicroelectronics (ST) has announced details of a new generation of decoder chips that will enable hybrid Internet/broadcast-TV set-top boxes (STBs) featured to deliver enhanced user experiences and ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=25371&amp;title=stmicroelectronicslaunches3dreadysettopboxic-Asia.html</guid><pubDate>Wed, 6 Jan 2010 00:00:00 +0800</pubDate></item></channel></rss>
