<?xml version="1.0" encoding="iso-8859-1"?><rss version="2.0"><channel><title>EDN India - Digital ICs</title><link>http://www.ednindia.com</link><description>EDN Asia - Digital ICs</description><language>en-US</language><copyright>Copyright 2008 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.</copyright><pubDate>Fri, 25 Jul 2008 09:00:02 +0800</pubDate><item><title>IMEC Reports Major Progress in EUV </title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=21226&amp;title=imecreportsmajorprogressineuv-Asia.html</link><description>IMEC reports functional 0.186µm2 32nm SRAM cells made with FinFETs from which the contact layer was successfully printed using ASML's full field extreme ultraviolet (EUV) Alpha Demo Tool (ADT). Applied ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=21226&amp;title=imecreportsmajorprogressineuv-Asia.html</guid><pubDate>Fri, 25 Jul 2008 00:00:00 +0800</pubDate></item><item><title>Qualcomm and IMEC collaborate on 3D Integration Research</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=21223&amp;title=qualcommandimeccollaborateon3dintegrationresearch-Asia.html</link><description>IMEC and Qualcomm Incorporated have announced that Qualcomm is the first fabless integrated circuit company to participate in IMEC's industrial affiliation program (IIAP) on three-dimensional (3D) integration. ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=21223&amp;title=qualcommandimeccollaborateon3dintegrationresearch-Asia.html</guid><pubDate>Fri, 25 Jul 2008 00:00:00 +0800</pubDate></item><item><title>Fully Integrated, 8:1 Multiplexer Supports Hi-Speed USB Applications</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=21172&amp;title=fullyintegrated81multiplexersupportshispeedusbapplications-Asia.html</link><description>Maxim Integrated Products has launced the MAX4999 differential, 8:1 multiplexer for Hi-Speed USB (USB 2.0) applications. This device switches between eight USB hosts and a single peripheral at data rates ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=21172&amp;title=fullyintegrated81multiplexersupportshispeedusbapplications-Asia.html</guid><pubDate>Fri, 18 Jul 2008 00:00:00 +0800</pubDate></item><item><title>STMicroelectronics Extends Serial EEPROM Range with 1MHz Devices in Densities up to 1 Mbit</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=21150&amp;title=stmicroelectronicsextendsserialeepromrangewith1mhzdevicesindensitiesupto1mbit-Asia.html</link><description>STMicroelectronics has introduced 1MHz two-wire serial EEPROMs in 256-Kbit, 512-Kbit and 1-Mbit densities, compatible with I2C Fast-Mode-Plus allowing data rates up to 2.5-times faster than the I2C Fast-mode. ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=21150&amp;title=stmicroelectronicsextendsserialeepromrangewith1mhzdevicesindensitiesupto1mbit-Asia.html</guid><pubDate>Wed, 16 Jul 2008 00:00:00 +0800</pubDate></item><item><title>Signametrics Corporation Announces More USB Digital Multimeters</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=21146&amp;title=signametricscorporationannouncesmoreusbdigitalmultimeters-Asia.html</link><description>Signametrics Corporation has released the SMU2060 and SMU2064 USB DMMs (Digital Multimeters). At 8 ounces with dimensions of 5'' X 7'' X 1.3'', these instruments provide a 90% reduction in size, weight ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=21146&amp;title=signametricscorporationannouncesmoreusbdigitalmultimeters-Asia.html</guid><pubDate>Wed, 16 Jul 2008 00:00:00 +0800</pubDate></item><item><title>Crossware Enhances 8051 Suite with Support for Silicon Lab</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=21145&amp;title=crosswareenhances8051suitewithsupportforsiliconlab-Asia.html</link><description>Crossware has enhanced its 8051 Development Suite by adding support for the C8051F9xx family of mixed signal microcontrollers from Silicon Laboratories.

The C8051F9xx is the industry's first family ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=21145&amp;title=crosswareenhances8051suitewithsupportforsiliconlab-Asia.html</guid><pubDate>Wed, 16 Jul 2008 00:00:00 +0800</pubDate></item><item><title>Micronas Single-Chip Audio Solution Targets Rapidly Growing Soundbar Market</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=21116&amp;title=micronassinglechipaudiosolutiontargetsrapidlygrowingsoundbarmarket-Asia.html</link><description>Micronas presents the MAP-M, a fully integrated single-chip audio solution for the emerging soundbar market. 

Soundbars are wide-but-thin powered speakers, located below a flat panel TV. Thin TVs simply ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=21116&amp;title=micronassinglechipaudiosolutiontargetsrapidlygrowingsoundbarmarket-Asia.html</guid><pubDate>Fri, 11 Jul 2008 00:00:00 +0800</pubDate></item><item><title>NXP Semiconductors tops new contactless payment, ticketing, and NFC IC vendor matrix ranking </title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=21066&amp;title=nxpsemiconductorstopsnewcontactlesspaymentticketingandnfcicvendormatrixranking-Asia.html</link><description>NXP Semiconductors has been ranked at the top of the latest Vendor Matrix released by ABI Research.

Inside Contactless and Infineon Technologies claimed the second and third spots in the company's ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=21066&amp;title=nxpsemiconductorstopsnewcontactlesspaymentticketingandnfcicvendormatrixranking-Asia.html</guid><pubDate>Mon, 7 Jul 2008 00:00:00 +0800</pubDate></item><item><title>Toshiba achieves higher hole mobility for future generation CMOS technology by twisted Direct Silicon Bonding technology</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=21058&amp;title=toshibaachieveshigherholemobilityforfuturegenerationcmostechnologybytwisteddirectsiliconbondingtechn-Asia.html</link><description>Toshiba Corporation has announced that, together with IBM Corporation, it has developed a higher performance CMOS FET, a high priority for advanced system LSI. The new technology matches the highest possible ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=21058&amp;title=toshibaachieveshigherholemobilityforfuturegenerationcmostechnologybytwisteddirectsiliconbondingtechn-Asia.html</guid><pubDate>Fri, 4 Jul 2008 00:00:00 +0800</pubDate></item><item><title>Pentek introduces high-speed software radio PMC module with power meter and beamforming capabilities</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=21057&amp;title=pentekintroduceshighspeedsoftwareradiopmcmodulewithpowermeterandbeamformingcapabilities-Asia.html</link><description>Pentek, Inc., has introduced its Model 7152, a quad 200 MHz, 16-bit A/D digitizer with a 32-channel digital down converter (DDC) configured in a PMC format. This high-speed module employs a high-performance, ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=6&amp;id=21057&amp;title=pentekintroduceshighspeedsoftwareradiopmcmodulewithpowermeterandbeamformingcapabilities-Asia.html</guid><pubDate>Fri, 4 Jul 2008 00:00:00 +0800</pubDate></item></channel></rss>
