EDN India - DSP

Texas Instruments unveils fully integrated analog front end for ECG and EEG applications

Tue, 3 Aug 2010 00:00:00 +0800

Texas Instruments Incorporated (TI) today introduced the first in a family of fully integrated analog front ends (AFEs) for portable and high-end electrocardiogram (ECG) and electroencephalogram (EEG) equipment, as well as patient monitoring and consumer medical applications. The eight-channel, 24-bit ADS1298 reduces component count and power consumption by up to 95 percent as compared to discrete implementations, with a power efficiency of 1 mW/channel, while allowing customers to achieve the h

Global Semi Revenue Now Forecast to Reach $310B

Tue, 3 Aug 2010 00:00:00 +0800

Already pumped up by bulging demand, the global semiconductor market in 2010 has been injected with a powerful dose of growth steroids, prompting iSuppli Corp. to raise its revenue forecast to a record ....

Teardown Puts HTC Droid Incredible's BOM at $163

Fri, 30 Jul 2010 00:00:00 +0800

HTC Corp.'s Droid Incredible smart phone carries a Bill of Materials (BOM) of $163.35, according to a dissection conducted by iSuppli Corp.'s Teardown Analysis Service. "The Droid Incredible could ....

DSP Development Platform Offers New Speed Grade Option

Fri, 23 Jul 2010 00:00:00 +0800

Texas Instruments Inc. (TI) announces the introduction of a new development platform and a new speed grade option for the TMS320C6457 digital signal processor (DSP). The simplified development platform ....

The Time is Now for 3-D Stacked Die

Tue, 20 Jul 2010 00:00:00 +0800

As the semiconductor industry moves from "more Moore" to "more than Moore," 3-D-stacked-die implementations will become critical for implementing ever-denser chip packages. Interest in the technology ....

Altera Organises Technology Roadshow 2010 Series in Asia

Mon, 12 Jul 2010 00:00:00 +0800

Altera Corp. is collaborating with its distributors to host free, technology-focused seminars across 16 cities in the Asia-Pacific region from August through November of 2010. The seminars will be held ....

Amkor and TI Shrink Bump Pitch by Up to 300%

Mon, 12 Jul 2010 00:00:00 +0800

Amkor Technology Inc. and Texas Instruments Inc. (TI) have qualified and begun production of the industry's first fine pitch copper pillar flip chip packages - shrinking bump pitch up to 300 percent compared ....

Freescale Accelerates Network Systems Design

Thu, 24 Jun 2010 00:00:00 +0800

It is not just about performance, but the applications development acceleration they offer. This is one of the key messages from Lisa Su, Freescale Semiconductor's Senior Vice President and General Manager, ....

Era of Connected Intelligence

Wed, 23 Jun 2010 00:00:00 +0800

During his keynote presentation at the opening of the Freescale Technology Forum 2010 here in Orlando, Florida, Freescale Semiconductor CEO Rich Beyer said that it is appropriate to learn the lessons ....

India's Competitive Advantages in Designs

Tue, 22 Jun 2010 00:00:00 +0800

India has a wide spectrum of competencies available on talent be it analog designs, software, silicon design, verification and validation, tools or other infrastructure for design. A combined availability ....

CEVA, Infineon Technologies Extend Collaboration to Next-gen Wireless Platforms

Wed, 9 Jun 2010 00:00:00 +0800

CEVA Inc. and Infineon Technologies have extended their long-term strategic relationship to include the dual MAC, 32-bit CEVA-TeakLite-III DSP core for the future mobile phone and modem platform solutions ....