<?xml version="1.0" encoding="iso-8859-1"?><rss version="2.0"><channel><title>EDN India - Embedded Development Tools</title><link>http://www.ednindia.com</link><description>EDN Asia - Embedded Development Tools</description><language>en-US</language><copyright>Copyright 2010 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.</copyright><pubDate>Thu, 11 Mar 2010 08:59:15 +0800</pubDate><item><title>eMemory, MagnaChip Collaborate on 0.11&amp;#956;m HV Embedded NVM Technology</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=9&amp;id=25817&amp;title=ememorymagnachipcollaborateon011956mhvembeddednvmtechnology-Asia.html</link><description>eMemory Technology Inc. and MagnaChip Semiconductor Ltd have announced the successful porting of eMemory's Neobit OTP (One Time Programmable) 0.11&amp;#956;m high-voltage embedded NVM at MagnaChip and the ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=9&amp;id=25817&amp;title=ememorymagnachipcollaborateon011956mhvembeddednvmtechnology-Asia.html</guid><pubDate>Thu, 11 Mar 2010 00:00:00 +0800</pubDate></item><item><title>Renesas R8C e-Learning Program</title><link>http://www.ednindia.com/rss_bridge.asp?AdID=719&amp;URL=http://www.ednasia.com/WebcastRegister.asp?webcastId=27</link><description>The objective of this course is to provide a quick and simple way to learn about the R8C Family of MCUs and the unique benefits it brings to today’s engineers. The R8C series is a result of careful planning and implementation of various design techniques, keeping in mind the present and future requirements of embedded systems. &lt;br/&gt;&lt;br/&gt;To equip engineers with the fundamental techniques on how to optimize applications using R8C MCUs, this course is divided into three modules...</description><guid>http://www.ednindia.com/rss_bridge.asp?AdID=719&amp;URL=http://www.ednasia.com/WebcastRegister.asp?webcastId=27</guid><pubDate>Fri, 5 Mar 2010 00:00:00 +0800</pubDate></item><item><title>11th Annual ISQED to Address Electronic Design Challenges, Trends, and Proven Methodologies</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=9&amp;id=25789&amp;title=11thannualisqedtoaddresselectronicdesignchallengestrendsandprovenmethodologies-Asia.html</link><description>The 11th annual International Symposium on Quality Electronic Design (ISQED), to be held on March 22-24, 2010 at the DoubleTree Hotel in San Jose, California, U.S.A., has just announced its lineup of ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=9&amp;id=25789&amp;title=11thannualisqedtoaddresselectronicdesignchallengestrendsandprovenmethodologies-Asia.html</guid><pubDate>Fri, 5 Mar 2010 00:00:00 +0800</pubDate></item><item><title>Sponsored by Keithley Instrument Inc.: Advanced Measurement Techniques for OFDM and MIMO Based Systems</title><link>http://www.ednindia.com/rss_bridge.asp?AdID=634&amp;URL=http://www.ednasia.com/WebcastRegister.asp?webcastId=24</link><description>This is the advanced seminar of a multi-part series on OFDM technologies and testing. &lt;br/&gt;&lt;br/&gt;By attending this seminar you will learn:&lt;br/&gt;&lt;br/&gt;1, Signal Generation and Analysis, Instrument Considerations.  &lt;br/&gt;2. Spectrum measurement techniques and their application to high speed power measurements.  &lt;br/&gt;3. OFDM Amplifier measurement considerations - Quantative Gain Compression.  &lt;br/&gt;4. SISO OFDM measurement techniques.  &lt;br/&gt;5. MIMO measurement considerations.  &lt;br/&gt;6. MIMO measurement techniques.</description><guid>http://www.ednindia.com/rss_bridge.asp?AdID=634&amp;URL=http://www.ednasia.com/WebcastRegister.asp?webcastId=24</guid><pubDate>Thu, 4 Mar 2010 00:00:00 +0800</pubDate></item><item><title>Actel Releases Development Environment for SmartFusion FPGAs</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=9&amp;id=25773&amp;title=actelreleasesdevelopmentenvironmentforsmartfusionfpgas-Asia.html</link><description>Actel Corp. has announced the immediate availability of its comprehensive and easy-to-use development environment for the newly introduced SmartFusion intelligent mixed signal FPGAs. The extensive ecosystem ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=9&amp;id=25773&amp;title=actelreleasesdevelopmentenvironmentforsmartfusionfpgas-Asia.html</guid><pubDate>Thu, 4 Mar 2010 00:00:00 +0800</pubDate></item><item><title>Sponsored by Analog Devices, Inc. : The new and improved practical guide to high-speed PCB layout</title><link>http://www.ednindia.com/rss_bridge.asp?AdID=583&amp;URL=http://www.ednasia.com/WebcastRegister.asp?webcastId=20</link><description>The New and Improved Practical Guide to High-Speed PCB Layout will cover the ins and outs of high speed PCB design, with a practical and straight forward approach. The presentation is packed with useful information accumulated over the last three decades by presenters John Ardizzoni. The tips, tricks and techniques presented can be easily implemented into designs and will help improve overall circuit and system performance. This webinar will be a good refresher, and a “must see”, for those...</description><guid>http://www.ednindia.com/rss_bridge.asp?AdID=583&amp;URL=http://www.ednasia.com/WebcastRegister.asp?webcastId=20</guid><pubDate>Thu, 4 Mar 2010 00:00:00 +0800</pubDate></item><item><title>Rabbit Launches Industry's First Wireless SoC for Industrial Automation Apps</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=9&amp;id=25772&amp;title=rabbitlaunchesindustrysfirstwirelesssocforindustrialautomationapps-Asia.html</link><description>Rabbit, a Digi International brand, has launched the Rabbit 6000, said to be the industry's first embedded wireless communications and control System on Chip (SoC) ideal for industrial automation applications. ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=9&amp;id=25772&amp;title=rabbitlaunchesindustrysfirstwirelesssocforindustrialautomationapps-Asia.html</guid><pubDate>Thu, 4 Mar 2010 00:00:00 +0800</pubDate></item><item><title>Altera Announces Industry's First TÜV-qualified Industrial Safety Data Package</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=9&amp;id=25766&amp;title=alteraannouncesindustrysfirsttvqualifiedindustrialsafetydatapackage-Asia.html</link><description>At the Embedded World Exhibition and Conference in Nuremberg, Germany, Altera Corp. has announced an industrial safety data package for automation applications. Working in conjunction with TÜV Rheinland, ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=9&amp;id=25766&amp;title=alteraannouncesindustrysfirsttvqualifiedindustrialsafetydatapackage-Asia.html</guid><pubDate>Wed, 3 Mar 2010 00:00:00 +0800</pubDate></item><item><title>Intel, TSMC Atom Manufacturing Deal Cools</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=9&amp;id=25751&amp;title=inteltsmcatommanufacturingdealcools-Asia.html</link><description>Lack of customer demand has cooled a deal inked last year between two chip industry giants - Intel Corp. and Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) that was to have covered the porting by Intel ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=9&amp;id=25751&amp;title=inteltsmcatommanufacturingdealcools-Asia.html</guid><pubDate>Mon, 1 Mar 2010 00:00:00 +0800</pubDate></item><item><title>STMicroelectronics Launches Latest SPEAr MPUs for Embedded-control Applications</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=9&amp;id=25725&amp;title=stmicroelectronicslauncheslatestspearmpusforembeddedcontrolapplications-Asia.html</link><description>STMicroelectronics (ST) has unveiled four new members in the SPEAr microprocessor family, targeting embedded-control applications across market segments from computer peripherals and communication to ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=9&amp;id=25725&amp;title=stmicroelectronicslauncheslatestspearmpusforembeddedcontrolapplications-Asia.html</guid><pubDate>Fri, 26 Feb 2010 00:00:00 +0800</pubDate></item><item><title>STMicroelectronics Announces 55nm Embedded Flash Process Technology for Automotive MCUs</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=9&amp;id=25696&amp;title=stmicroelectronicsannounces55nmembeddedflashprocesstechnologyforautomotivemcus-Asia.html</link><description>STMicroelectronics has announced its 55nm embedded Flash (eFlash) process technology, which will be implemented in its next-generation automotive microcontroller (MCU) chips. ST is extending its production ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=9&amp;id=25696&amp;title=stmicroelectronicsannounces55nmembeddedflashprocesstechnologyforautomotivemcus-Asia.html</guid><pubDate>Tue, 23 Feb 2010 00:00:00 +0800</pubDate></item><item><title>Mistral Enhances Kopin's Golden-i Developers Kit</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=9&amp;id=25691&amp;title=mistralenhanceskopinsgoldenideveloperskit-Asia.html</link><description>Mistral Solutions has collaborated with Kopin Corp. on its Golden-i platform, which is set to redefine mobile computing and communication. Kopin leveraged Mistral's extensive experience with OMAP35x processors ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=9&amp;id=25691&amp;title=mistralenhanceskopinsgoldenideveloperskit-Asia.html</guid><pubDate>Mon, 22 Feb 2010 00:00:00 +0800</pubDate></item><item><title>Physical Layer Reference Stack for UMTS Femtocell Products Supports up to 32 Users</title><link>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=9&amp;id=25679&amp;title=physicallayerreferencestackforumtsfemtocellproductssupportsupto32users-Asia.html</link><description>Texas Instruments Inc. (TI) announced the availability of a 3GPP voice and data physical layer reference stack for UMTS femtocell products designed for Release 6 and 7 compliance. Based on TI's System-on-a-Chip ....</description><guid>http://www.rbia-subn.com/gotoArticle/goArticle.asp?mag=EDNI&amp;newscatid=9&amp;id=25679&amp;title=physicallayerreferencestackforumtsfemtocellproductssupportsupto32users-Asia.html</guid><pubDate>Fri, 19 Feb 2010 00:00:00 +0800</pubDate></item></channel></rss>
