STMicroelectronics, STATS ChipPAC and Infineon to Set New Milestone in Establishing Wafer-Level-Packaging Industry Standard 19/8/2008

STMicroelectronics , STATS ChipPAC, and Infineon Technologies AG have signed an agreement to jointly develop the next-generation of embedded Wafer-Level Ball Grid Array (eWLB) technology, based on Infineon’s first-generation technology, for use in manufacturing future-generation semiconductor packages. ST and Infineon, two of the world’s leading semiconductor makers, have joined forces with STATS ChipPAC, a leader in advanced three dimensional (3D) packaging solutions, to fully exploit the potential of Infineon’s existing eWLB packaging technology, ...