Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50% 24/7/2008

C-MAC MicroTechnology used Flomerics' Flotherm thermal simulation software to determine that the thermal requirements of a stacked module could be met with a potting compound that cost only half the amount of the default choice. ''Our engineer simulated the junction temperatures of the devices in the stacked modules while using three different potting compounds,'' said Bob Hunt, Head of Engineering for C-MAC. ''Simulation was much faster and less expensive than the alternative of building and testing prototypes.'' C-MAC, an electronics design and ...