EV Group Supplies 300-mm Equipment to STMicroelectronics for the Manufacture of Image Sensors Using TSV Technology 21/7/2008

EV Group (EVG) has received a major multi-million-euro order from STMicroelectronics for its 300-mm bonding, alignment and photoresist processing tools. EVG's fully automated tools are successfully installed at ST's 300-mm through-silicon-via (TSV) pilot line in Crolles, France and used in the manufacture of CMOS imaging sensors (CIS). Industry experts have anticipated that the first products that feature TSV technology are expected to hit the market in 2008 and will include flash memory and image sensors, similar to what ST is developing with ...