Imec, Synopsys to Partner on 3D Stacked IC Development 10/3/2010

Synopsys Inc. and the Belgian nanoelectronics research center Imec have entered into a collaboration to use Synopsys TCAD (Technology Computer-Aided Design) finite-element method tools for characterizing and optimizing the reliability and electrical performance of through-silicon vias (TSVs). The collaboration will accelerate the development of 3D stacked IC technologies. While considered an emerging technology, 3D stacked IC complements conventional transistor scaling and allows multiple chips to be stacked and integrated into a single package. ...

11th Annual ISQED to Address Electronic Design Challenges, Trends, and Proven Methodologies 5/3/2010